Introduce Technology For Keywords

• Advanced design technologies

  Superior pattern design by our certified (JPCA level one and two Certified Printed wiring Designers) design engineers.

  Design

• Short delivery shift

  Design support, using two shifts, 24 hours a day, 365 days a year.

  Pattern design

• Impedance control wiring

  With simulations and comunication with the manufacturing site, we are able to design patterns with emphasis on impedance control.

  Various simulation analysis

• DFM verification

  With almost 300 design rules used in designing, we are able to detect problematic processes and improve prior to manufacture, thus cutting down the number of prototypes needed.

  Manufacture specifications check

• EMC design services

  Using 39 chapters of Electronic rules regarding EMC, SI, PI, etc, we are able to instruct EMC design effectively.

  EMC design rules check

• Silicone free

  Type zero (0) contains no Siloxane.

  Magic resin carrier/basic specs

• Environmental conservation / cost-reduction

  Repairs to Magic resin (reforming), recycling of the carrier base material, and shaping of the resin to customer demands.

  Magic resin carrier repair

• Response to a high-speed signal

  With our Lamination technology that creates even thickness on each layer, and our conductor processing, we are able to create a highly stable impedance controlled product.

  Build-up boards

• High density

  High density boards utilizing Laser drilled vias, Fill-plating, stacked vias and build-up lamination technology.

  Build-up boards Semiconductor package

• Thinner boards -1

  Ultra-thin multi-layered build-up boards utilizing ultra-thin cores, or coreless boards.

  Build-up boards Semiconductor package

• Thinner boards -2

  By combining flex boards and build-up technology, our Flex rigid boards require no connector boxes, thus saving space, and with laser drilling, we can achieve thinner, smaller boards.

  Flex-rigid substrate

• Downsizing -1

  Achieve downsizing with the latest laser drilled via shaping, and improved fine-pitch wiring density

  Build-up boards Semiconductor package

• Downsizing -2

  By combining flex boards and build-up technology, our Flex rigid boards require no connector boxes, thus saving space, and with laser drilling, we can achieve thinner, smaller boards.

  Flex-rigid substrate

• Connection reliability

  By utilizing the board edges with half-through hole technology, we increase the area and adhesion of solder, thus providing better connectivity.

• Conserving space

  By utilizing component mountable cavities, we are able to lower the board's height and save space.

  Cavity board

• High durability and high reliability

  Experienced in supplying boards requiring high durability and high reliability in our multi-layer through-hole boards for the automotive, medical, and industrial (robotics) industries.

• Multi-pin densification

  Using laser processing and semi-additive patterning, we can provide higher pin count with higher density.

  Semiconductor package

• Small quantity, large variety

  We have solutions for your small quantity large variety issues.

  Outsourcing

• Prototype short delivery

  Capable of very short delivery times.

  Outsourcing

• Mass production

  Open to suggestions such as Overseas production or VE, VA that will increase competetiveness.

  Outsourcing

• Security

  We offer the service and support that only a trusted PCB maker can offer.

  Outsourcing