Products
Pattern design
The first step of the manufacturing is a design.
Features of pattern design
We provide consistent services through design and manufacturing for every board such as mother boards, package boards.
We apply all sorts of simulation analysis, EMC design rule check, and DFM check for the approach of the high quality product.
We provide the design milieu for focusing the express correspondence depending on customers needs.
| Design management that aims to the efficiency | 2shifts and 24/7 handling | Divided design role | Design that considered manufacturing yield rate |
| Varied simulation analysis | EMC provision design & rule-management | Strictly keep delivery date | Confidentiality obligation/Data spill prevention |
Design spec
Please provide the below data.
| Schematic | Net list | Design spec | Outline drawing |
| Part list | Remainder | Constraint | Pad spec |
Data format
We accept varied data output format.
Pattern design case example
Example 1
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≪Design spec≫
Outline □16mm L/S 50um / 47um Total pin numbers 368 pin Total number of Parts - VIA spec
Drill diameter/pad diamete- LV
- φ0.10/φ0.25mm
- IVH
- φ0.15/φ0.25mm
Bonding pad spec Stagger / Pitch : 137um
Pad width：88um(Top70um Min.)
Pad space：49um(30um Min.) -
≪Applicable support≫
high density design is achieved concurrently with the substrate processing technology.
4-layer Build-up(1-2-1) / Capped on Via
Example 2
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≪Design spec≫
Outline 114.1mm x 61.4mm L/S 75um / 75um Total pin numbers 4,960 pin Total number of Parts 1,253 VIA spec
Drill diameter/pad diamete- LV
- φ0.10/φ0.30mm
- IVH
- φ0.25/φ0.60mm
- TH
- φ0.25/φ0.60mm
-
≪Applicable support≫
- Impedance control
- DDR2 Waveform control + Timing control
- DDR2 Waveform comparison
- EMC design rule apply
10 layer stacks(3-4-3) + IVH + TH
