Products
Magic-Resin CarrierPatent 3328248・3435157・3585904・3857254・4522890＆PAT・P
Characteristics
- An assembly process transport carrier for FPC,COF,TCP,Flex-rigid,and thin PWB.
- From ACF attachment to SMT to Molding, all processes can be done on the same carrier.(Transport carrier for processes before and after SMT.)
- For device mounting and solder bump affixation and reflow carrier on interposer boards.
- No need for heat resistant tape!
- Adaptable to FPCs with uneven supports.
- Endure 500 reflow cycles.
- Registration accuracy of placement for substrate units is +/-30 microns.
- Already in use with FPC,COF,CCD, and CMOS boards for cellular phones.
Specification
| Base Material | High heat resistant Glass Epoxy,AL,SUS etc |
|---|---|
| MagicResin specs | Resin area can be made partial or full coated |
| Size able to process | Maximum 300 x 500 mm |
| Processible contents | drilling, cutting, tapering, C-chamfering are possible. |
- Low molecular weight siloxane
- Low molecular weight siloxane(Type-ZERO)
- Pb free soldering(High heat resist & high durability)
- different adhesion power
Magic Resin carrier Process
- Set the removal plate at fixture with pins.
- Set up the FPC bottom side up on the plate.。
- Set up the Magic Resin carrier bottom side.
- Take off the fixture with pin.
- Turn over the jig.
- Take off the removal plate.
- FPC location & fixation complete on Magic Resin carrier.
- ACF coating→Cream solder→Mounter→Reflow→CSP seal material coating.
- Take off FPC from the carrier.
- Adhesion characteristic.
- Maintenance after 500 re-flow cycles : Cleaning with IPA, water, neutral detergent.
Additionally, we have manufacturing experiences according to various specs. Feel free to ask us directly regarding any inquiry.
