Products
Component attachment, assembly
We can fully support high-density attachments.
We offer full, flexible support from the purchase of components to design of the patterns
they will be placed, to actual assembly.
This can save our customer time in waiting for orders.
Production Capacity
We can meet your needs from prototype to mass production.1.SMT Assembly capability
- Attachment lines : 15 lines
- 4 Million chips attached per month.
（QFP : 0.4mm pitch / Chip : type 1608 or similar）
2.High-Density attachments.
- BGA, CSP, 0402 size attachment
- Flip Chip Attachment
3.Lead-Free material assembly possible.
4.Fast Prototype Delivery (at the fastest, 2 working days)
Product Samples
- Attachment on Flexible boards
- Flip Chip Attachment
Attachable Components:
Flip Chip, 0603Chip, 1005Chip, Diodes
Flip Chip
Dimensions: 2.144 x 1.015 x 0.725
Bump count: 18pin
Bump Pitch: 0.211
Additionally, we have manufacturing experiences according to various specs. Feel free to ask us directly regarding any inquiry.
