This is a rigid construction substrate made with organic materials.
Aside from conventional drills to make the holes, we can also utilize laser drilling, requiring smaller connection lands, creating more freedom in design of conductor patterns. Also, depending on the specification, we can use the subtractive or semi-additive method to form the patterns for various circuitry needs.
♦Bonding pitch: 70um
♦Pad width / gap: 40um/30um
Characteristics
Conductors created with subtractive or semi-additive method.
Using laser drilling for smaller, thinner, higher pin-count and higher density.
Total support from design all the way to the final product.
Surface finishing with OSP, Au plating, ENEPIG, and others.
Construction
Drilled plated through holes (via)
Filled vias with plated caps.
Laser drilled via with land.
Laser drilled plated through hole.
Laser drilled filled via with land.
Four layer drilled plated through hole (via)
Four layer filled vias with plated caps
Conductor Specifications
（Units: microns）
Category
Contents
Layers
2 Layers to 4Layers
Overall thickness
Min.100（2L） Min.190（4L）
Line / Space
inner layer
Min.25/25
Outer layer
Min.20/20
Via / Land
Min.80/150
Via Pitch
Min.180
These are just some of the specifications we can meet – Please inquire directly with your needs.
Build-up Construction Substrates
This is a Build-up construction substrate.Our build-up layers primarily use pre-preg for higher dimension precision and finer conductor lines. Furthermore, with our core-less build-ups and various design rules, we can meet your needs for a smaller, thinner board that makes assembly easier.
