Products
Products
We produce high density highly reliable semi-conductor package substrates for image processing systems, memory systems, communications systems, application processors, etc.
Application | Rigid Construction Substrates | Build-up Construction Substrates | Core-less Technology | UNaFI | Magic-Regin Carrier |
---|---|---|---|---|---|
Image processing | ○ | ○ | |||
Memory | ○ | ○ | ○ | ||
Power devices | ○ | ○ | |||
RF | ○ | ○ | ○ | ||
Baseband | ○ | ||||
Automotive | ○ | ○ | |||
Application processor | ○ | ○ | |||
Fingerprint sensor | ○ |